LASERTEC 30 SLM 3rd Generation
Additive Manufacturing by selective laser melting (SLM)
Max. X-axis stroke
325 mm
Max. Y-axis stroke
325 mm
Max. Z-axis stroke
400 mm
Min. Layer thickness
30 µm
Min. Focus diameter
80 µm
Laser power standard
600 W
Highlights
Additive Manufacturing by selective laser melting (SLM) in powder bed
- Highly complex components with function integration
- Internal close-contoured cooling channels
- Weight optimisation due to lattice and honeycomb structures as well as topology-optimised components
- Simultaneous build-up of different designs
- Shorter product development times by quickly available prototypes made of series materials
100% machine tool design for SLM technology
- Build volume of 325 x 325 x 400 mm
- Single-, Dual- or Quad-Laser with high-precision optics and full overlap
- Exchangeable build container for reduced job-to-job time
- Bi-directional recoating with collision protection system
- CELOS X with easyAM – guided workflows for simplified machine operation and maintenance
New benchmark for robustness and repeatability
- Thermosymmetric casting frame for highest rigidity
- Floating process chamber for minimized thermal shifts
- Active temperature compensation for z-axis positioning
- Protective glass monitoring to detect smoke residues and weld penetrations
- Powder bed monitoring for anomaly detection
rePLUG – The powder module for fast material change
- Automated powder handling: Integrated powder-recycling for maximum efficiency and highest work-safety due to closed material cycle
- One material per rePLUG – Any expansion of the material range due to modular changing system for contamination-free changeover
- Integrated sieving and powder drying functionality under inert gas atmosphere
- Industrialized powder fill-in-interfaces and precise weight detection in main tank
- Optional: rePLUG FLEX - the additional powder module, especially developed for the material and process parameter development on the series system
Application Examples
Control & Software
CELOS X: New design with focus on simplicity and transparency
- easyAM – Guided workflows for machine operation
- Maintenance app for active assistance through regular machine servicing tasks
- Easy integration of customer-specific requirements due to modularity
- State-of-the-art software architecture ensures reliable performance
- Connectivity: Supports a variety of interfaces such as OPC / UA, MQTT, MTConnect, and more
Service & Training
Downloads & Technical Data
Technology Data
Min. Focus diameter
80 µm
Min. Layer thickness
30 µm
Laser power standard
600 W
Work Area
Max. X-axis stroke
325 mm
Max. Y-axis stroke
325 mm
Max. Z-axis stroke
400 mm